Capabilities

The product works when the disciplines work together.

Product definition, acoustic systems, transducers, electronics, RF, power, mechanical engineering, DSP, prototyping and verification — connected around one product intent.

Electronics engineer working at a hardware bench

Capability detail

Depth where the product needs it.

01 Definition & planning Product and system definition The intended experience, technical targets, responsibilities and learning plan are made visible before detailed execution begins.
01

Goals and specifications

Translate product intent into a shared set of goals, requirements and technical specifications.

02

Work breakdown and stakeholders

Structure the work, identify decision owners and keep cross-domain interfaces visible.

03

Risk and schedule planning

Build the schedule, assess and mitigate risk, form the team and establish information sharing.

04

Design of experiments

Identify where structured experiments can replace assumption with measurable evidence.

02 Acoustic systems Acoustic system engineering Simulation, objective measurement and subjective evaluation connect the industrial-design concept to the final system response.
01

Concept evaluation

Compare industrial-design concepts through acoustic simulation, objective response including directivity, and subjective evaluation.

02

System simulation

Model wave radiation, enclosures, ports, passive radiators, system THD, excursion and nonlinear behavior.

03

Crossover and DSP

Develop and optimize crossovers, filters and DSP tuning as part of the complete acoustic architecture.

04

Measurement and characterization

Use full- and half-space anechoic measurement plus nonlinear and thermal characterization to close the design loop.

03 Transducers Transducer and acoustic-module engineering Component work spans micro to professional formats and connects motor, suspension, waveguide, thermal and mechanical behavior.
01

Format range

Micro, headphone, tactile, compact, full-range, coaxial, hi-fi, low-profile, compression and professional woofer formats.

02

Motor and suspension

Electromagnetic saturation, motor inductance, suspension optimization and demagnetization-temperature analysis.

03

Mechanical simulation

Waveguide, structural stress and tinsel-lead simulation connect component decisions to real operating conditions.

04

System integration

Balance the driver, enclosure, amplifier and DSP so component capability translates into system performance.

04 Electronics, RF & power Electronics, connectivity and power Signal path, amplification, power, battery and RF decisions are developed as one integrated product architecture.
01

Audio electronics

Discrete, Class AB, Class D, digital Class D and Class G amplification with driver, DSP and amplifier integration.

02

Power and battery systems

Mains supply topologies, charging, battery management, protection and multi-cell lithium architectures.

03

RF development loop

Requirements and constraints, proposals, simulation, fabrication, measurement, tuning, verification and validation.

04

Engineering toolchain

Schematic and PCB design, circuit simulation, version-controlled libraries and data analysis support repeatable decisions.

05 Mechanical Mechanical engineering, materials and finishes Structure, thermal behavior, optics, materials and manufacturing process are evaluated together around the product intent.
01

Simulation and reliability

Thermal and airflow analysis, vibration, deformation and stress, drop and shock, plus optical illumination studies.

02

Molding and failure analysis

Injection-molding simulation, deformation analysis and CT-based failure analysis support design learning.

03

Enclosures and materials

Wood, die-cast or extruded aluminium, injection or extruded plastic and waterproof cabinet architectures.

04

Finishes, fabrics and grilles

Transfer processes, metallic paint, anodizing, fabric wrapping, stitching, etching, stamping and extrusion.

06 DSP & software DSP, signal processing and application integration Software capability focuses on the processing and control layers that connect the acoustic system to the product experience.
01

DSP tuning

Configure and tune the signal path around the acoustic system, product constraints and intended listening experience.

02

Signal processing

Develop flexible processing chains and multi-channel configurations for consumer and professional applications.

03

Voice processing

Integrate voice-processing functions where the product architecture and user context require them.

04

Application software

Integrate app software alongside DSP, signal processing and voice processing.

07 Evidence Prototyping, verification and review PoC and PoA builds connect design, simulation, verification, data analysis and documented learning.
01

Plan the evidence

Set goals and specifications, assess risk and identify the design-of-experiments needed to answer critical questions.

02

Build to learn

Use PoC and PoA builds with status tracking, design and simulation.

03

Verify and analyze

Connect verification and validation to structured data collection and performance analysis.

04

Review and retain

Report prototype performance, retain technical documentation, conclude and capture lessons learned.

Holistic design

Optimization is a system behavior.

The strongest answer rarely comes from maximizing one component. It comes from understanding how performance, size, power, cost, robustness and production interact.

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